TCDP 2023 Awards Announcement
Dear Members and Friends of IEEE CS Technical Community on Distributed Processing:
We are pleased to announce the recipients of 2023 IEEE TCDP Awards:
– H. T. Kung (Harvard University) for the Outstanding Technical Achievement
We thank all nominators and supporters for the quality nomination packages we received.
We would also like to thank the TCDP award committee members listed below:
Ken Birman, Cornell University
Jiannong Cao (co-Chair), Hong Kong Polytechnic University
Chita Das, Pennsylvania State University
Nancy Lynch, Massachusetts Institute of Technology
Michel Raynal, IRISA, University of Rennes
Jie Wu, Temple University
Xiaodong Zhang (co-Chair), Ohio State University
Xiaobo Zhou, University of Colorado, Colorado Springs
The award plaques, together with a cash prize of $2000 will be presented in IEEE ICDCS’2023 at Hong Kong, China, during July 18 – 21, 2023.
Please join us in congratulating the awardees.